| http://www.w3.org/ns/prov#value | - First stud openings, are generally formed in two successive etching steps, using two different masks: GS and CA. After a two-step cleaning, a photoresist adhesion promoter such as HMDS is applied onto the structure (prebake time: 7 mn), followed by standard photoresist, (e.g. the e-MERCK resin), preferably, with MTI MULTIFAB equipment, and baked.
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