| http://www.w3.org/ns/prov#value | - The wafer is then scribed or sawn into individual dice, and finishing operations including packaging are conducted on the singulated dice. [0007] It is typically desirable to apply a supportive or protective layer on at least the active surfaces of semiconductor devices, such as flip-chip type dice and chip scale packages, that will be disposed facedown over a higher-level substrate.
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