PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The slurry containing the abrasive particles formed of material such as alumina or manganese oxide is used for the CMP polishing process of the conductive film such as the metal wiring line film 5 and the barrier film 4.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com