| http://www.w3.org/ns/prov#value | - Here too, it can be necessary to avoid premature reaction of the components by cooling the formulated resin/hardenersystem of the invention.The epoxy resin composition of the invention can be used for coating and adhesive bonding of a great variety of materials, for example, metals, light metals, and also nonmetallic materials such as ceramic, glass, leather, rubber, wood, plastic,etc.
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