| http://www.w3.org/ns/prov#value | - Next, as shown in FIG. 6A, copper is deposited as the material of the second interconnection covering the first interconnection 4 a exposed in the connection hole 61, the inside of the connection hole 61, the inside of the interconnection groove 81, and the interlayer insulating film 8 by, for example, CVD, to form a metal layer 10 of a thickness of for example 1.4 ??m.
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