| http://www.w3.org/ns/prov#value | - After the protruding regions 180 of the metal traces 178 are connected to the copper traces 60 using a thermal pressing process, a polymer material 74, such as epoxy or polyimide, can be formed between the semiconductor chip 182 and the gold layer 78 on the bottom surface of the inner leads 68, and enclosing the metal traces 178.
|
