| http://www.w3.org/ns/prov#value | - After the protruding regions 190 of the metal traces 188 are connected to the copper traces 60 using a thermal pressing process, a polymer material 74, such as epoxy or polyimide, can be formed between the semiconductor chip 192 and the gold layer 78 on the bottom surface of the inner leads 68, and enclosing the metal traces 188.
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