| http://www.w3.org/ns/prov#value | - Further, according to the present invention, in order to protect the substrate from deformation, including extension or warping, due to changes in atmospheric temperature or differences in process temperatures, a metal carrier having a low CTE, such as SUS304, Invar, or Kovar, is used, thus stably fabricating the PCB regardless of such changes in temperature or humidity.
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