About: http://webisa.webdatacommons.org/392716619

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Electrically conductive barrier materials that can be used with the solder interconnection of this invention and that is not wettable to dolder include materials such as Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com