About: http://webisa.webdatacommons.org/395726163

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention provides an improved barrier layer between copper and various materials, including dielectrics and aluminum, and with better surface adhesion to reduce electro-migration.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com