PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • These external conductor pads 15 are connected to a power source circuit board, a control board and thelike, which are not shown in the figures, via wires or the like.FIG. 4 is a diagram of a via structure (through-hole structure) in the multilayer dielectric substrate 2 of the high-frequency package 1.
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