| http://www.w3.org/ns/prov#value | - material, by laser or other light or photo beam in the production of semiconductor wafers - - - Other -Operated by ultrasonic processes: - - - Machines for dry-etching patterns on semiconductor materialsCD% (3) 5 20 5 5 5 108452.9010 8452.9090 84.5310 58453.1000 8453.2000 8453.8000 8453.9000 84.545 5 5 58454.1000 8454.2000 8454.3000 8454.9000 84.55 8455.1000 8455.2100 8455.2200 8455.3010 8455.309
|
