| http://www.w3.org/ns/prov#value | - Employed as the semiconductor device for the simulation were a semiconductor device which included semiconductor chips 1 a and 1 b having thicknesses of 300 {acute over (i)}m and 100 {acute over (i)}m, respectively, and a resin sealer having a thickness of 800 {acute over (i)}m in accordance with this embodiment and a semiconductor device which included semiconductor chips 1 a and 1 b each having
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