| http://www.w3.org/ns/prov#value | - A multi-layer, three-dimensional circuit comprising:at least two molded three-dimensional substrates with substantially planar mating surfaces, each substrate including a layer of patterned conductive material on at least one surface, wherein a portion of the layer of conductive material on at least one of the surfaces is on a non-planar surface, and electrically conductive vias at selected locati
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