| http://www.w3.org/ns/prov#value | - A method of fabricating a semiconductor device including a step of laminating a wiring-forming multi-layered metal foil consisting of three layer of metal foil/etching stopper foil/metal foil to a semiconductor wafer formed at the surface thereof with circuit elements on the electrode forming surface side, a step of forming a bump-forming resist wiring pattern on the multi-layered metal foil, a st
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