| http://www.w3.org/ns/prov#value | - A method for manufacturing a semiconductor integrated circuit device, comprising the steps of: (a) forming a groove for wiring in a first insulating film formed on a semiconductor substrate; (b) successively forming a barrier layer and a conductive film over said first insulating film including the inside of said groove for wiring and removing said barrier layer and said conductive film from outsi
|
