| http://www.w3.org/ns/prov#value | - A method of fabricating a semiconductor device according to a second aspect of the present invention is a method of fabricating a semiconductor device, including: a step of fabricating the lead frame by the above-mentioned method; a step of carrying the semiconductor chip on the sealed surface of the chip support; and a step of resin-sealing the lead frame, together with the semiconductor chip, su
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