| http://www.w3.org/ns/prov#value | - mpact hybrid IC-MEMS integration and packaging concepts; Increased use of thin-film, wafer-level packaging and system integration concepts; Growing synergies between MEMS manufacturing equipment and IC/MEMS packaging equipment; Trend toward low-temperature technologies that can be applied on a variety of substrates, such as IC wafers, glass and laminate.Zero-level Packaging ConceptsMEMS in wafer f
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