| http://www.w3.org/ns/prov#value | - A method of connecting an IC chip and a substrate including a conductive layer sandwiched between insulating layers, the method comprising the steps of: (a) disposing a heat-radiating mechanism between the IC chip and the substrate; (b) fixing the IC chip to the heat-radiating mechanism; (c) disposing plural through-holes in at least one of the insulating layers; and (d) disposing connection membe
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