| http://www.w3.org/ns/prov#value | - SUMMARY OF THE INVENTION A method for forming bumps of the present invention is a method for forming on a front face of a substrate bumps for establishing an electrical connection with an external part, including the steps of: forming the plurality of bumps and an insulating film between the bumps on the front face of the substrate; performing planarization by cutting using a tool so that surfaces
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