| http://www.w3.org/ns/prov#value | - A method for producing a semiconductor device having a lead on chip (LOC) structure using a first frame including an outer frame in a first plane and a die pad connected to the outer frame and displaced from the first plane, and a second frame comprising an outer lead frame, a plurality of leads extending inwardly from the outer lead frame, and frame-cutting slits in said outer lead frame of said
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