| http://www.w3.org/ns/prov#value | - mask over substantially all of the circuitry and other portions of the laminate; (2) exposing and developing said photoimageable solder mask such that the solder mask covers substantially all of said circuitry except for the pads, lands, and tabs, (3) curing said developed solder mask to form a permanent coating; and (c) step (c) comprises screening a desensitizing mask over the solder mask such
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