| http://www.w3.org/ns/prov#value | - A method of encapsulating integrated circuits with epoxy, comprising:moving a dispensing pump relative to an integrated circuit located on a support, the dispensing pump including a pumping chamber having an internal volume and an outlet therefor defined by a surrounding side wall, the internal volume being filled with the epoxy to be dispensed and bounded, opposite the outlet, by a first seal and
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