| http://www.w3.org/ns/prov#value | - A method of producing a printed circuit board in accordance with the process of claim 1, wherein said substrate is a bare insulating board, and which comprises, following formation of the image of the polymeric material, the step of:(4) plating an electroless deposit of a conductive metal on the areas other than the areas of the image of the polymeric material, optionally followed by electro-depos
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