| http://www.w3.org/ns/prov#value | - The passivation layer 122 is formed continually by depositing and etching an inorganic material such as SiNx or SiOx, or an organic material such as BCB (benzocyclobutene) with masks of the source/drain electrodes 104 a, 104 b after n+ dry etching the ohmic contact layer 113 (S4).
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