| http://www.w3.org/ns/prov#value | - That is, a semiconductor device, such as semiconductor device of the plurality of semiconductor devices 78 and more specifically the semiconductor device 130 shown in phantom on the block 110 is urged upwardly to be in contact with the curable adhesive 132 that has been positioned on each lead frame of the plurality of lead frames 12 by the application means 32.
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