PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The interposer is used to electrically connect an external electrode and the semiconductor chip 4. [0007] The substrate 2 is formed of such a material as a polyimide resin, a ceramic resin, and a glass-epoxy resin.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.es