About: http://webisa.webdatacommons.org/405596443

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The invention relates to plastic encapsulation of electronic devices, and more specifically, to injection molding an encapsulation for an electronic device directly onto a substrate such as a printed circuit board.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com