| http://www.w3.org/ns/prov#value | - A conductive layer (not shown) of interconnect metal or other conductive material can then be deposited in the contact holes and patterned to leave remaining portions that comprise the interconnection metallization to silicide regions (not illustrated) formed on the N-type source region 472, N-type anode region 466, the N-type source region 482 and the N-type drain region 494.
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