| http://www.w3.org/ns/prov#value | - barrier layer on the substrate, such as a titanium or tantalum containing barrier layer and depositing a ruthenium layer on the barrier layer; depositing a tungsten nucleation layer on the ruthenium layer and depositing a tungsten bulk layer on the tungsten nucleation layerUS7465665May 15, 2007Dec 16, 2008Applied Materials, Inc.Method for depositing tungsten-containing layers by vapor deposition
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