About: http://webisa.webdatacommons.org/408596055

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Further, the present invention is a method for providing a solder layer on a multi-layer circuit board composite by depositing solder on a carrier sheet attached to a cover sheet of an electrically conducting material.
http://www.w3.org/ns/prov#wasQuotedFrom	google.fr