| http://www.w3.org/ns/prov#value | - The resin, such as epoxy resins or the like, used for filling the coil gap usually has a thermal shrinkage factor of 1.8-3.0% when cooled from the glass transition temperature to a liquid helium temperature, i.e. 4.2K. Meanwhile, the superconducting wires have a thermal shrinkage factor of about 0.3-0.4% under the same condition.
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