| http://www.w3.org/ns/prov#value | - The no lead package is usually mounted on a board such as a PCB, with the exposed surfaces of the metal contacts and/or die pad soldered to the bonding pads on the PCB. Thus in a no lead package such as, for example, a quad flat no lead (QFN) package, the metal leads are generally nearly flush with a surface of the encapsulation.
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