About: http://webisa.webdatacommons.org/409973008

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This invention generally relates to a molding method for a semiconductor chip package and more particularly to a molding method for a BGA semiconductor chip package.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com