About: http://webisa.webdatacommons.org/410328244

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Any suitable process, such as chemical-mechanical polishing (CMP) or etching, may be employed to remove any excess conductive material and planarize this layer (to achieve the structure shown in FIG. 4C).
http://www.w3.org/ns/prov#wasQuotedFrom	google.com