| http://www.w3.org/ns/prov#value | - In the process for removing this barrier film 105, not a slurry SL having a high polishing rate with respect to the metal film 107 made of copper described above, but a slurry SL having a high polishing rate with respect to the barrier film 105 formed by a material such as Ta, TaN, Ti, or TiN, and having a low polishing rate with respect to the metal film 107 is used.
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