About: http://webisa.webdatacommons.org/411615156

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The semiconductor device 50 is subjected to heat when it is mounted on a printed circuit board, and especially a bottom portion of the plastic package 55 is influenced by a heat stress.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com