About: http://webisa.webdatacommons.org/411844362

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Therefore, there is a problem that, when the sealing film made of thermosetting resin such as epoxy system resin is hardened, the semiconductor wafer is relatively significantly warped.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com