| http://www.w3.org/ns/prov#value | - Winbond has introduced the technology at the 65-nm node, but they also have 46-nm parts under development.One other point was made by Qimonda before they went under, that this technology is particularly suitable for a cell shrink from the current 6F2 to a 4F2 format, enabling even more cost savings by reducing die size.
|
