| http://www.w3.org/ns/prov#value | - 01 to 200 Pa???s, especially 0.1 to 100 Pa???s, and a phenolic hydroxyl equivalent of 100 to 2,000, especially 200 to 1,000. [0057] In the conductive resin composition of the invention, the silicone-modified epoxy resin and the silicone-modified phenolic resin are preferably used in combination. [0058] The amount of the silicone-modified resin in the conductive resin composition is not critical.
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