| http://www.w3.org/ns/prov#value | - In manufacturing steps of the above substrate 10, such electrically insulating material as polyimide, polyether imide, polyamide, liquid crystal or the like is employed to form the insulative base by means of the injection molding, and the protrusions 26 are formed at mounting positions of the LED chips 1 while through holes 26 a are formed within the protrusions 26.
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