About: http://webisa.webdatacommons.org/41595496

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In prior art devices, such as the device illustrated in FIG. 1, the bond-pads 14 are wire-bonded to the interior pads 22 outboard the die 10, which increases the footprint of the interposer substrate 20.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com