About: http://webisa.webdatacommons.org/416590538

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	For example, in flip chip technology the die is mounted face down and contact to the BGA is made through solder balls, rather than wire bonds such as 4 in FIG. 1.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com