| http://www.w3.org/ns/prov#value | - Note that the partition walls (insulating layers) 520 may be formed using an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride; acrylic acid, methacrylic acid, or a derivative thereof; a heat-resistant polymer, such as polyimide, aromatic polyamide, polybenzimidazole; or a siloxane resin.
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