About: http://webisa.webdatacommons.org/418127178

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 3 shows an embodiment multiple die assembly 300 using thermal conducting substrates placed between semiconductor dies such as semiconductor die 130 from FIG. 1.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com