PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Upon completion of the trench formation, a masking layer or other protective material for dry etching silicon is applied to the substrate 32 to protect the silicon material during the dry etch process as described above.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.ca