About: http://webisa.webdatacommons.org/418494776

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	bump, and does not substantially include lead; and the second metallic portion is a farthest metallic portion of the conductive bump with respect to the semiconductor die, and wherein the second metallic portion includes lead. 2.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com