About: http://webisa.webdatacommons.org/420387503

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Generally, the present invention described herein is a method for forming conductive bumps on an IC using a radiation imageable conductive polymer in conjunction with lithographic processing techniques.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com