| http://www.w3.org/ns/prov#value | - Referring to FIG. 6B, following formation of the microbump interconnect 16MB to the configuration shown in FIG. 6A, a contact layer 60MB can be formed on the microbump contact members 42MB and on the input/output pads 46MB. The contact layer 60MB can be formed of an inert metal such as palladium deposited using an electroless plating process as previously described.
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