About: http://webisa.webdatacommons.org/421838481

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In FIG. 1, a semiconductor device 1 mainly comprises a substrate 2, a semiconductor chip 4, solder balls (bumps) 6, and a sealing resin 8.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com